Soft Devices & Packaging Laboratory
Director in SAIT (삼성종합기술원)
Director in DMC Research Institute
Dow Corning
NIST
Advanced packaging materials
Soft functional devices
Deep & Machine learning
Bio-inspired electronic devices
Energy harvesting devices
Advanced packaging process
Structural and thermal simulation
Flexible display
Bio-compatible sensors
Laser-assisted die bonding
Soft electronics
Energy harvesting materials
Structural simulation
Stretchable electronic devices
Materials development for soft devices
Synthesis of nanomaterials
MXene-based functional materials
Functional devices
Design of Packaging Circuits
Smart Functional Devices
Advanced Semiconductor Packaging
Advanced Packaging Materials
Materials for Flexible Electronics
Materials Synthesis and Analysis
Pb-free Soldering
Hybrid Bonding
Reliability of Packaging Materials
Mechanical & thermal modeling
Machine learning
Optimization of packaging structure
Reliability evaluation
Analysis of packaging materials
Functional display
Synthesis of functional polymers
Development of packaging materials
Machine learning for smart devices
Fabrication of ADP
Materials for Advanced Packaging Technologies
Management of research funds
Handling of assorted paperwork