Dual‑Stage Pressure Sensing Enabled by a Photopatternable Urethane–Acrylate Dual‑Network Elastomer and Process‑Encoded Hierarchical Interfaces for Optical Reflectance Modulation

Min Soo Baek, Su Bin Choi, Yeonwook Jeong, Roun Lee, Han-Ki Kim*, Youngmin Kim*, and Jong-Woong Kim*,

Polyimide dot clampers: Preventing electrostatic damage for enhanced durability and performance in fibrous triboelectric nanogenerators

Chang-Hyun Song, Jung Bin Shin, Roun Lee, Youngmin Kim, Chan-Jae Lee*, Jong-Woong Kim*,

Color-Coded Intense Pulsed Light Reflow: A Breakthrough Selective Heating Technology for Advanced Multi-Semiconductor Packaging

Taejoon Noh, Ho-Kyeong Seong, Minjae Sung, Jaejun Yoon, Jong-Woong Kim*, Seung-Boo Jung*,
Advanced Science, , corresponding author (IF: 14.1)

Sn-3.0Ag-0.5Cu/OSP solder joints assembled using multi-wavelength light

Hyo-Won Lee , Eun-Chae Noh, Jong-Woong Kim*, Seung-Boo Jung, Jeong-Won Yoon*,
Materials Today Communications, 47, 113279 , corresponding author (IF: 4.5)

Rapid-Response Hybrid Piezo-Triboelectric Pressure Sensor Using All-Fabric Materials for Enhanced Sensing and Power Generation

Su bin Choi‡, Sushmitha Veeralingam‡, Jun Sang Choi, Kampara Roopa Kishore, Tran Duc Khanh, Seung-Boo Jung*, Jong-Woong Kim*,
Nano Energy, 140, 111000 , corresponding author (IF: 17.1)

Deep learning-developed multi-light source discrimination capability of stretchable capacitive photodetector

Su Bin Choi‡, Jun Sang Choi‡, Hyun Sik Shin‡, Jeong-Won Yoon*, Youngmin, Kim*, Jong-Woong Kim*,
npj Flexible Electronics, 9, 44 , corresponding author (IF: 15.5)

Water-repellent and self-repairing capabilities integration: Enhancing longevity and practicality of fabric-based flexible devices

Su Bin Choi, Youngmin Kim*, Jong-Woong Kim*,
Applied Surface Science Advances, 25, 100691 , corresponding author (IF: 8.7)

A Review of Strategies for Improving Brittleness in Sn-58wt%Bi Solder for 3D Semiconductor Packaging Applications

Yeon Soo Park, Min Gyu Park, Byung Jun Kim, and Jong-Woong Kim*,
J. Microelectronic Packaging Society, 31, 1 , corresponding author

Properties of Sn-3.0Ag-0.5Cu solder joints under various soldering conditions: Reflow vs. Laser vs. Intense Pulsed Light soldering

Eun-Chae Noh, Hyo-Won Lee, Jong-Woong Kim, Seung-Boo Jung, Jeong-Won Yoon*,
Journal of Materials Research and Technology, 33, 6622 , corresponding author (IF: 6.6)

Autonomous Self-Healing in a Stretchable Polybutadiene-Based Urethane and Eutectic Gallium Indium Conductive Composite

Tran Duc Khanh, Jinho Joo*, Jong-Woong Kim*,
npj Flexible Electronics, 8, 79 , corresponding author (IF: 15.5)

Highly durable and conductive Korea Traditional Paper (Hanji) embedded with Ti3C2Tx MXene for Hanji-based Paper Electronics

Jaehoon Jeong, Hae-Jun Seok, Hak Shin, Su Bin Choi, Jong-Woong Kim*, Han-Ki Kim*,
Nano Energy, 131, Part B, 110325 , corresponding author (IF: 17.1)

Stretchable Piezoresistive Pressure Sensor Array with Exceptional Sensitivity, Strain-Insensitivity, and Reproducibility

Su Bin Choi†, Taejoon Noh†, Seung-Boo Jung*, Jong-Woong Kim*,
Advanced Science, 11, 35 , corresponding author (IF: 14.1)

Dual-Responsive Fully Self-Healing Triboelectric Pressure Sensor: Integrating Truncated Sphere Morphology with Deep Learning-Enhanced Signal

Su Bin Choi, Jong-Woong Kim*,
Nano Energy, 128, 109833 , corresponding author (IF: 17.1)

Self-Repairing Thermoplastic Polyurethane-Based Triboelectric Nanogenerator with Molybdenum Disulfide Charge-Trapping for Advanced Wearable Devices

Tran Duc Khanh, Sushmitha Veeralingam, Jong-Woong Kim*,
Nano Energy, 127, 109714 , corresponding author (IF: 17.1)

Full Integration of Highly Stretchable Inorganic Transistors and Circuits within Molecular-Tailored Elastic Substrates on a Large Scale

Seung-Han Kang†, Jeong-Wan†, Jong Min Lee, Sanghee Moon, Seung Bum Shin, Su Bin Choi, Donghwan Byeon, Jaehyun Kim, Myung-Gil Kim, Yong-Hoon Kim*, Jong-Woong Kim*, Sung Kyu Park*,
Nature Communications, 15, 2814 , corresponding author (IF: 15.7)