Failure mechanism of Pb-bearing and Pb-free solder joints under high-speed shear loading

Jong-Woong Kim and Seung-Boo Jung.
Metals and Materials International, 16, 7 (IF: 1.815)

Characteristics of printed thin films using indium tin oxide (ITO) ink

Sung-Jei Hong, Jong-Woong Kim, Jae-Won Lim, Good-Sun Choi and Minoru Isshiki.
Materials Transactions, 51, 1905 (IF: 0.689)

Effects of the concentration of indoim-tin-oxide (ITO) ink on the characteristics of directly-printed ITO thin films

Jong-Woong Kim*, Jangwoo Choi, Sung-Jei Hong, Jeong-In Han, Young-Sung Kim.
Journal of the Korean Physical Society, 57, 1794 (IF: 0.445)

Characterization of direct patterned Ag circuits for RF application

Jong-Woong Kim, Young-Chul Lee, Jong-Min Kim, Wansoo Nah, Hyo-Soo Lee, Hyuk-Chon Kwon and Seung-Boo Jung.
Microelectronic Engineering, 87, 379 (IF: 1.277)

Solder joint reliability in flip chip package with surface treatment of ENIG under thermal shock test

Sang-Su Ha, Sang-Ok Ha, Jin-Kyu Jang, Jeong-Won Yoon, Jong-Woong Kim, Min-Kwan Ko, Dae-Gon Kim, Myung-Wan Ko and Seung-Boo Jung.
Metals and Materials International, 15, 655 (IF: 1.815)

Reliability of Au bump flip chip packages with adhesive materials using four-point bending test

Bo-In Noh, Jeong-Won Yoon, Jong-Woong Kim, Jong-Bum Lee, Noh-Chang Park, Won-Sik Hong, Seung-Boo Jung.
International Journal of Adhesion and Adhesives, 29, 650 (IF: 1.956)

Failure behaviors of flip chip solder joints under various loading conditions of high-speed shear test

Sang-Su Ha, Sang-Ok Ha, Jin-Kyu Jang, Jong-Woong Kim, Jong-Bum Lee and Seung-Boo Jung.
International Journal of Modern Physics B, 23, 1809 (IF: 0.850)

Mechanical property evaluation of Sn-3.0Ag-0.5Cu BGA solder joints using high-speed ball shear test

Sang-Su Ha, Jin-Kyu Jang, Sang-Ok Ha, Jong-Woong Kim, Jeong-Won Yoon, Byung-Woo Kim, Sung-Kyu Park and Seung-Boo Jung.
Journal of Electronic Materials, 38, 2489 (IF: 1.491)

Electrical Characterization of Screen-Printed Conductive Circuit with Silver Nanopaste

Jong-Woong Kim and Seung-Boo Jung.
Japanese Journal of Applied Physics, 48, 06FD14 (IF: 1.122)

Ultrasonic Bonding of Electrodes of Rigid and Flexible Printed Circuit Boards with Non-Conductive Film (NCF)

Jong-Bum Lee, Ja-Myeong Koo, Jong-Woong Kim, Bo-In Noh, Jong-Gun Lee and Seung-Boo Jung.
Journal of Adhesion, 85, 341 (IF: 1.409)

Fabrication and electrical characterization of Through-Si-Via interconnect for 3D packaging

Jong-Woong Kim and Seung-Boo Jung.
Journal of Micro/Nanolithography, 8, 013040 (IF: 1.355)

Transmission property of flip chip package with adhesive interconnection for RF applications

Jong-Woong Kim, Wansoo Nah and Seung-Boo Jung.
Microelectronic Engineering, 86, 314 (IF: 1.277)

Failure behaviors of BGA solder joints under various loading conditions of high-speed shear test

Jong-Wooong Kim, Young-Chul Lee, Sang-Su Ha and Seung-Boo Jung.
Journal of Materials Science: Materials in Electronics, 20, 17 (IF: 1.798)

Electromigration behavior in Sn-37Pb and Sn-3.0Ag-0.5Cu flip chip solder joints under high current density

Sang-Su Ha, Jong-Woong Kim, Jeong-Won Yoon and Seung-Boo Jung.
Journal of Electronic Materials, 38, 70 (IF: 1.491)

Evaluation of thermal and hygro-thermal behavior on flip chip package with non-conductive paste

Bo-In Noh, Jong-Bum Lee, Jong-Woong Kim and Seung-Boo Jung.
Journal of Adhesion Science & Technology, 22, 1355 (IF: 0.863)