Ductile Fracture Mechanism of Low-Temperature In–48Sn Alloy Joint Under High Strain Rate Loading

Jong-Woong Kim, and Seung-Boo Jung.
Journal of Nanoscience and Nanotechnology, 12, 3259 (IF: 1.338)

Evaluation of drop reliability of Sn–37Pb solder/Cu joints using a high speed lap-shear test

Seong-jae Jeon, Jong-Woong Kim, Byunghoon Lee, Hak-Joo Lee, Seung-Boo Jung, Seungmin Hyun, Hoo-Jeong Lee*.
Microelectronic Engineering, 91, 147 (IF: 1.277)

Characteristics of IndiumTinOxide (ITO) Glass Re-Used from Old TFT-LCD Panel

Sung-Jei Hong*, Min-Sun Kim, Jong-Woong Kim, and Myeongsuk Shin.
Materials Transactions, 53, 968 (IF: 0.689)

Enhancement of Synthetic Speed of Ag Nanoparticle for Electrodes of Solar Cells by Using Microwave Radiation

Sung-Jei Hong∗, Jong-Woong Kim and Sung-Won Lee, Young Sung Kim, Nam-Kee Kang.
Journal of the Korean Physical Society, 60, 2067 (IF: 0.445)

Introduction of an Electroless-Plated Ni Diffusion Barrier in Cu/Sn/Cu Bonding Structures for 3D Integration

Byunghoon Lee, Haseok Jeon, Soonjae Kim, Kee-won Kwon, Jong-Woong Kim, and Hoo-jeong Lee*.
Journal of The Electrochemical Society, 159, H85 (IF: 3.014)

Flexibility of Silver Conductive Circuits Screen-Printed on a Polyimide Substrate

Kwang-Seok Kim, Young-Chul Lee, Jong-Woong Kim, and Seung-Boo Jung∗.
Journal of Nanoscience and Nanotechnology, 11, 1493 (IF: 1.338)

Electrical Characteristics of Printed Ag Nanopaste on Polyimide Substrate

Young-Chul Lee, Kwang-Seok Kim, Jong-Woong Kim, Jong-Min Kim, Wansoo Nah, Seong-Hee Lee, and Seung-Boo Jung∗.
Journal of Nanoscience and Nanotechnology, 11, 1468 (IF: 1.338)

Shear test parameters for brittle fracture of flip chip solder joint

Sang-Su Ha, Jong-Woong Kim, Sang-Ok Ha and Seung-Boo Jung*.
Materials Science and Technology, 27, 696 (IF: 1.18)

Characteristics of eco-friendly synthesized SiO2 dielectric nanoparticles printed on Si substrate

Jong-Woong Kim*, Sung-Jei Hong, and Min-Gi Kwak.
Microelectronic Engineering, 88, 797 (IF: 1.277)

Effect of heat treatment on physical and electrical characteristics of conductive circuits printed on Si substrate

Jong-Woong Kim, Byung-Kwon Jeon, Sung-Won Lee, Sung-Jei Hong, Young-Seok Kim, Min-Gi Kwak, Nam Kee Kang, Young-Chul Lee, and Seung-Boo Jung.
Microelectronic Engineering, 88, 791 (IF: 1.277)

Improvement of electrical properties of printed ITO thin films by heat-treatment conditions

Sung-Jei Hong, Jong-Woong Kim, Jeong In Han.
Current Applied Physics, 11, S202 (IF: 2.144)

High frequency characteristics of printed Cu conductive circuit

Jong-Woong Kim, Young-Chul Lee, Kwang-Seok Kim, Seung-Boo Jung.
Journal of Nanoscience and Nanotechnology, 11, 537 (IF: 1.338)

Synthesis of Cu Nanoparticles with Self-Assembled Monolayers via Inert-Gas Condensation

Min-Kyu Kang, Jong-Woong Kim, Min-Gi Kwak, Ho-Gyu Yoon, and Young-Seok Kim∗.
Journal of Nanoscience and Nanotechnology, 11, 6020 (IF: 1.338)

Effect of Sintering Temperature on Electrical Characteristics of Screen-Printed Ag Nanopaste on FR4 Substrate

Young-Chul Lee, Jee-Hyuk Ahn, Kwang-Seok Kim, Jeong-Won Yoon, Jong-Woong Kim, Yongil Kim, and Seung-Boo Jung∗.
Journal of Nanoscience and Nanotechnology, 11, 5915 (IF: 1.338)

Physical and electrical properties of SiO2 layer synthesized by eco-friendly method

Jong-Woong Kim*, Young-Seok Kim, Sung-Jei Hong, Tae-Hwan Hong and Jeong-In Han.
Japanese Journal of Applied Physics, 49, 05EA02 (IF: 1.122)