Soft Devices & Packaging Laboratory
Influence of shear speed on the shear force of eutectic Sn-Pb and Pb-free BGA solder joints
Jong-Woong Kim, Jeong-Won Yoon and Seung-Boo Jung. Materials Science Forum, 897, 449-452 (IF: 0.399)
Experimental and finite element analysis of the shear speed effects on the Sn-Ag and Sn-Ag-Cu BGA solder joints
Jong-Woong Kim and Seung-Boo Jung. Materials Science & Engineering A, 371, 267 (IF: 2.647)