Effects of bonding pressure on the thermo-mechanical reliability of ACF interconnection

Jong-Woong Kim, Won-Chul Moon and Seung-Boo Jung.
Microelectronic Engineering, 83, 2335 (IF: 1.277)

Effects of number of reflows on the mechanical and electrical properties of BGA package

Bo-In Noh, Ja-Myeong Koo, Jong-Woong Kim, Dae-Gon Kim, Jae-Do Nam, Jinho Joo and Seung-Boo Jung.
Intermetallics, 14, 1375 (IF: 2.541)

Characteristic analysis of electroless Ni plating layer for electronic packaging

Dae-Gon Kim, Jong-Woong Kim, Jeong-Won Yoon, Won-Bae Lee, Seung-Boo Jung.
Surface and Interface Analysis, 38, 440 (IF: 1.018)

Evaluation of solder joint reliability in flip chip package under thermal shock test

Dae-Gon Kim, Jong-Woong Kim and Seung-Boo Jung.
Thin Solid Films, 504, 426 (IF: 1.761)

Investigations of the test parameters and bump structures in the shear test of flip chip solder bump

Jong-Woong Kim, Dae-Gon Kim and Seung-Boo Jung.
Thin Solid Films, 504, 405 (IF: 1.761)

Reexamination of the solder ball shear test for evaluation of the mechanical joint strength

Jong-Woong Kim and Seung-Boo Jung.
International Journal of Solids and Structures, 43, 1928 , corresponding author (IF: 2.081)

Effects of void formation within the Pb-free BGA solder balls on the mechanical joint strength

Jong-Woong Kim and Seung-Boo Jung.
Materials Science Forum, 510-511, 546-549 (IF: 0.399)

Evaluation of displacement rate effect in shear test of Sn-3Ag-0.5Cu solder bump for flip chip application

Jong-Woong Kim, Dae-Gon Kim and Seung-Boo Jung.
Microelectronics Reliability, 46, 535 (IF: 1.202)

Board-level reliability of Pb-free surface mounted assemblies during thermal shock testing

Jong-Woong Kim, Hyun-Suk Chun, Sang-Su Ha, Jong-Hyuck Chae, Jinho Joo, Young-Eui Shin and Seung-Boo Jung.
Advanced Materials Research, 633, 15-17 (IF: 0.333)