Soft Devices & Packaging Laboratory
Physical and electrical properties of SiO2 layer synthesized by eco-friendly method
Jong-Woong Kim*, Young-Seok Kim, Sung-Jei Hong, Tae-Hwan Hong and Jeong-In Han. Japanese Journal of Applied Physics, 49, 05EA02 (IF: 1.122)
Failure mechanism of Pb-bearing and Pb-free solder joints under high-speed shear loading
Jong-Woong Kim and Seung-Boo Jung. Metals and Materials International, 16, 7 (IF: 1.815)
Characteristics of printed thin films using indium tin oxide (ITO) ink
Sung-Jei Hong, Jong-Woong Kim, Jae-Won Lim, Good-Sun Choi and Minoru Isshiki. Materials Transactions, 51, 1905 (IF: 0.689)
Effects of the concentration of indoim-tin-oxide (ITO) ink on the characteristics of directly-printed ITO thin films
Jong-Woong Kim*, Jangwoo Choi, Sung-Jei Hong, Jeong-In Han, Young-Sung Kim. Journal of the Korean Physical Society, 57, 1794 (IF: 0.445)
Characterization of direct patterned Ag circuits for RF application
Jong-Woong Kim, Young-Chul Lee, Jong-Min Kim, Wansoo Nah, Hyo-Soo Lee, Hyuk-Chon Kwon and Seung-Boo Jung. Microelectronic Engineering, 87, 379 (IF: 1.277)