Ductile Fracture Mechanism of Low-Temperature In–48Sn Alloy Joint Under High Strain Rate Loading

Jong-Woong Kim, and Seung-Boo Jung.
Journal of Nanoscience and Nanotechnology, 12, 3259 (IF: 1.338)

Evaluation of drop reliability of Sn–37Pb solder/Cu joints using a high speed lap-shear test

Seong-jae Jeon, Jong-Woong Kim, Byunghoon Lee, Hak-Joo Lee, Seung-Boo Jung, Seungmin Hyun, Hoo-Jeong Lee*.
Microelectronic Engineering, 91, 147 (IF: 1.277)

Characteristics of IndiumTinOxide (ITO) Glass Re-Used from Old TFT-LCD Panel

Sung-Jei Hong*, Min-Sun Kim, Jong-Woong Kim, and Myeongsuk Shin.
Materials Transactions, 53, 968 (IF: 0.689)

Enhancement of Synthetic Speed of Ag Nanoparticle for Electrodes of Solar Cells by Using Microwave Radiation

Sung-Jei Hong∗, Jong-Woong Kim and Sung-Won Lee, Young Sung Kim, Nam-Kee Kang.
Journal of the Korean Physical Society, 60, 2067 (IF: 0.445)

Introduction of an Electroless-Plated Ni Diffusion Barrier in Cu/Sn/Cu Bonding Structures for 3D Integration

Byunghoon Lee, Haseok Jeon, Soonjae Kim, Kee-won Kwon, Jong-Woong Kim, and Hoo-jeong Lee*.
Journal of The Electrochemical Society, 159, H85 (IF: 3.014)