Soft Devices & Packaging Laboratory
Fibrous Percolation Electronics Enabled by Direct Writing of MXene Networks on Hierarchical Cellulose Architectures using Aerosol Jet Printing
Joon Jang et al. Advanced Materials, (Under review), (IF: 29.1)
Sustainable and High-Performance Piezoresistive Sensors via Graphene-Catalyzed Metallization of Self-Healable Microfiber Scaffolds
ByungJun Kim et al. Advanced Science, (Revision submitted), (IF: 14.1)
Intrinsically Stretchable Large-Area Pixelated Electrochromic Displays via Direct Photopatterning
Kang Sik Kim et al. Nature Communications, (Accepted), (IF: 18.1)
Dual-scale polyimide dot clampers for durable fiber-based triboelectric nanogenerator
Chang-Hyun Song et al. npj Flexible Electronics, (Accepted), (IF: 15.4)
Precursor-Assisted Engineering of Accessible Pore Topology in Spherical h-BN for Thermally Conductive and Dielectrically Benign Underfill Composites
Jung Bin Shin et al. Advanced Composites and Hybrid Materials, (Under review), (IF: 15.5)
Photopatternable Dual-Network Elastomer Enables Interlocked Hierarchical Dielectrics for Four-Stage Broad-Range Capacitive Pressure Sensing
Min Soo Baek et al. Small, (Under review), (IF: 11.8)
Mitigating Contact-Constricted Thermal Bottlenecks by Magnetically Programmable hBN Bridge Fillers in Al₂O₃/Epoxy Composites
Yeonwook Jeong et al. Small, (Under review), (IF: 11.8)
Effect of Reflow Process on Solder Joing Reliability under Free-Form Surface Conditions
Taeyoon Im et al. Journal of Materials Engineering and Performance, (Under review), (IF: 2.6)
Hardware-level piezoresistive signal decoupling for multimodal sensing with deep learning–assisted interpretation
Wooseok Kim et al. Nature Electronics, (Under review), (IF: 42.3)