Publication

Soft Devices & Packaging Laboratory

Journal

Under Review Mitigating Contact-Constricted Thermal Bottlenecks by Magnetically Programmable hBN Bridge Fillers in Al₂O₃/Epoxy Composites

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작성자 최고관리자 작성일 25-10-10 19:24

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Author
Yeonwook Jeong et al
Journal
Small
Vol
(Under review)
Year
Under Review
IF
11.8