Effect of high-speed loading conditions on the fracture mode of the BGA solder joint

Jong-Woong Kim, Jin-Kyu Jang, Sang-Ok Ha, Sang-Su Ha, Dae-Gon Kim and Seung-Boo Jung.
Microelectronics Reliability, 48, 1882 (IF: 1.202)

Microwave performance of flip chip interconnects with anisotropic and non-conductive films

Jong-Woong Kim, Young-Chul Lee, Wansoo Nah and Seung-Boo Jung.
Journal of Adhesion Science & Technology, 22, 1339 (IF: 0.863)

Mechanical reliability of Sn-rich Au–Sn/Ni flip chip solder joints fabricated by sequential electroplating method

Jeong-Won Yoon, Hyun-Suk Chun, Bo-In Noh, Ja-Myeong Koo, Jong-Woong Kim, Hoo-Jeong Lee and Seung-Boo Jung.
Microelectronics Reliability, 48, 1857 (IF: 1.202)

Mechanical reliability evaluation of Sn-37Pb solder joint using high speed lap-shear test

Seong-jae Jeon, Seungmin Hyun, Hak-Joo Lee, Jong-Woong Kim, Sang-Su Ha, Jeong-Won Yoon, Seung-Boo Jung and Hoo-Jeong Lee.
Microelectronic Engineering, 85, 1967 (IF: 1.277)

Effect of boron content in electroless Ni-B layer on plating layer properties and soldering characteristics with Sn-Ag solder

Jeong-Won Yoon, Ja-Myeong Koo, Jong-Woong Kim, Sang-Su Ha, Bo-In Noh, Chang-Yong Lee, Jong-Hyun Park, Chang-Chae Shur and Seung-Boo Jung.
Journal of Alloys and Compounds, 466, 73 (IF: 3.014)

Thermal degradation of anisotropic conductive film joints under temperature fluctuation

Jong-Woong Kim, Ja-Myeong Koo, Chang-Yong Lee, Bo-In Noh, Jeong-Won Yoon, Dae-Gon Kim, Sun-Kyu Park and Seung-Boo Jung.
nternational Journal of Adhesion and Adhesives, 28, 314 (IF: 1.956)

Effect of displacement rate on bump shear properties of electriplated solder bumps in flip-chip packages

Ja-Myeong Koo, Yu-Na Kim, Jeong-Won Yoon, Dae-Gon Kim, Bo-In Noh, Jong-Woong Kim, Jung-Hoon Moon and Seung-Boo Jung.
Materials Science & Engineering A, 483-484, 620 (IF: 2.647)

Effect of reflow numbers on the interfacial reaction and shear strength of flip chip solder joints

Dae-Gon Kim, Jong-Woong Kim, Sang-Su Ha, Bo-In Noh, Ja-Myeong Koo, Dong-Woon Park, Myung-Wan Ko and Seung-Boo Jung.
Journal of Alloys and Compounds, 458, 253-260 (IF: 3.014)

Effect of bonding conditions on conduction behavior of anisotropic conductive film

Jong-Woong Kim, Young-Chul Lee and Seung-Boo Jung.
Metal and Materials International, 14, 373 (IF: 1.815)

Lap joint properties of FSWed dissimilar formed 5052 Al and 6061 Al alloys with different thickness

Chang-Yong Lee, Won-Bae Lee, Jong-Woong Kim, Don-Hyun Choi, Yun-Mo Yeon and Seung-Boo Jung.
Journal of Materials Science, 43, 3296 (IF: 2.302)

Effect of atmospheric pressure plasma treatment on transverse ultrasonic bonding of gold flip-chip bump on glass substrate

. Ja-Myeong Koo, Jung-Lae Jo, Jong-Bum Lee, Yu-Na Kim, Jong-Woong Kim, Bo-In Noh, Jeong-Hoon Moon, Dae-Up Kim and Seung-Boo Jung.
Japanese Journal of Applied Physics, 47, 4309 (IF: 1.122)

Electrical characterization of adhesive flip chip interconnects for microwave application

Jong-Woong Kim, Young-Chul Lee, Sang-Su Ha, Ja-Myeong Koo, Jae-Hoon Ko, Wansoo Nah and Seung-Boo Jung.
Journal of Micro/Nanolithography, 7, 23007 (IF: 1.335)

Analysis of failure mechanism in anisotropic conductive and non-conductive film interconnections

Jong-Woong Kim, Dae-Gon Kim, Young-Chul Lee and Seung-Boo Jung.
IEEE Transactions on Components and Packaging Technologies, 31, 65 (IF: 1.151)

Mechanical and electrical properties of Cu/Sn-3.5Ag/Cu ball grid array (BGA) solder joints after multiple reflows

Ja-Myeong Koo, Bui Quoc Vu, Yu-Na Kim, Jong-Bum Lee, Jong-Woong Kim, Dae-Up Kim, Jeong-Hoon Moon and Seung-Boo Jung.
Journal of Electronic Materials, 37, 118 (IF: 1.491)

Reliability of conductive adhesives as a Pb-free alternative in flip chip applications

Jong-Woong Kim, Young-Chul Lee and Seung-Boo Jung.
Journal of Electronic Materials, 37, 9 (IF: 1.491)