Advanced Semiconductor Packaging

We develop solutions for high-performance computing and AI, focusing on thermally conductive composites with optimized filler alignment, thermal interface materials (TIMs), and robust underfills, ACF/NCF films for flip-chip assemblies. Our processes include advanced solder reflow, Cu/Sn/Ni metallization, and hybrid bonding (e.g., Cu-Cu direct bonding) for HBM-oriented 3D stacking, enabling high-bandwidth, low-latency, and energy-efficient architectures. Reliability is ensured through testing under thermal shock, humidity, and high-power conditions, supporting AI accelerators and data-intensive applications.

Quantum Computing Packaging

For quantum computing, we design packaging for cryogenic environments (10-100 mK) to maintain qubit coherence and scalability. We develop cryogenic-compatible superconductors (e.g., niobium, aluminum) for low-loss interconnects, low-thermal-conductivity insulators (e.g., sapphire, silicon), and vacuum-compatible encapsulants to minimize noise. Processes include low-temperature bonding (e.g., indium bump bonding), precision wire bonding, and hermetic sealing for ultra-high vacuum conditions. Reliability is tested under thermal cycling and cryogenic conditions to ensure low-resistance interconnects and minimal crosstalk for large-scale quantum processors.