Optimization of shear test for flip chip solder bump using 3-dimensional computer simulation

Jong-Woong Kim and Seung-Boo Jung.
Microelectronic Engineering, 82, 554 (IF: 1.277)

Analysis of the test parameters in the shear test of BGA solder joints

Jong-Woong Kim, Sun-Kyu Park and Seung-Boo Jung.
Key Engineering Materials, 851, 297-300 (IF: 0.224)

Investigations of interfacial reaction and shear strength between Pb-free flip chip solder and electroplated Cu UBM

Dae-Gon Kim, Hyung-Sun Jang, Jong-Woong Kim and Seung-Boo Jung.
Key Engineering Materials, 863, 297-300 (IF: 0.224)

Evaluation of solder joint reliability in flip chip packages during accelerated testing

Jong-Woong Kim, Dae-Gon Kim, Won Sik Hong and Seung-Boo Jung.
Journal of Electronic Materials, 34, 1550 (IF: 1.491)

Reliability evaluations of flip chip package under thermal shock test

Dae-Gon Kim, Jong-Woong Kim and Seung-Boo Jung.
Microelectronic Engineering, 82, 554 (IF: 1.277)

Effect of aging conditions on interfacial reaction and mechanical joint strength between Sn-3.0Ag-0.5Cu solder and Ni-P UBM

Dae-Gon Kim, Jong-Woong Kim and Seung-Boo Jung.
Materials Science & Engineering B, 121, 204 (IF: 2.331)

Correlation between the interfacial reaction and mechanical joint strength of the flip chip solder bump during isothermal aging

Dae-Gon Kim, Hyung-Sun Jang, Jong-Woong Kim & Seung-Boo Jung.
Journal of Materials Science: Materials in Electronics, 16, 603-609 (IF: 1.798)

Optimum shear height for evaluation of Pb-free solder ball shear strength

Jong-Woong Kim, Sun-Kyu Park and Seung-Boo Jung.
Materials Science Forum, 269, 486-487 (IF: 0.399)

olid state interfacial reaction and joint strength of Sn-37Pb solder with Ni-P under bump metallization in flip chip application

Dae-Gon Kim, Jong-Woong Kim, Jung-Gu Lee, Hirotaro Mori, David J. Quesnel and Seung-Boo Jung.
Journal of Alloys and Compounds, 395, 80 (IF: 3.014)

Characterization of the shear test method with low melting point In-48Sn solder joints

Jong-Woong Kim and Seung-Boo Jung.
Materials Science & Engineering A, 397, 145 (IF: 2.647)

Correlation between the displacement rate and shear force in the shear test of Sn-Pb and Pb-free solder joints

Jong-Woong Kim, Jinho Joo, David J. Quesnel and Seung-Boo Jung.
Materials Science and Technology, 21, 373 (IF: 1.18)

Mechanical strength test method for solder ball joint in BGA package

Jong-Woong Kim, Dae-Gon Kim and Seung-Boo Jung.
Metal and Materials International, 11, 121 (IF: 1.815)