Interfacial reaction and joint reliability of fine-pitch flip-chip solder bump using stencil printing method

Sang-Su Ha, Dae-Gon Kim, Jong-Woong Kim, Jeong-Won Yoon, Jin-Ho Joo, Young-Eui Shin and Seung-Boo Jung.
Microelectronic Engineering, 84, 2640 (IF: 1.277)

Reliability of adhesive interconnections for application in display module

Jong-Woong Kim, Young-Chul Lee, Dae-Gon Kim and Seung-Boo Jung.
Microelectronic Engineering, 84, 2691 (IF: 1.277)

Design of solder joint structure for flip chip package with an optimized shear test method

Jong-Woong Kim and Seung-Boo Jung.
Journal of Electronic Materials, 36, 690 (IF: 1.491)

Thermal and hygroscopic reliability of flip chip packages with an anisotropic conductive film

Jong-Woong Kim and Seung-Boo Jung.
Journal of Adhesion Science & Technology, 21, 1071 (IF: 0.863)

Behavior of anisotropic conductive film joints bonded in various forces under temperature fluctuation

Jong-Woong Kim and Seung-Boo Jung.
Journal of Electronic Materials, 36, 1199 (IF: 1.491)

Reliability evaluation of underfill encapsulated Pb- free flip chip package under thermal shock test

Dae-Gon Kim, Jong-Woong Kim, Sang-Su Ha, Ja-Myeong Koo, Bo-In Noh and Seung-Boo Jung.
Materials Science Forum, 544-545, 621 (IF: 0.399)

Characterization of failure behaviors in anisotropic conductive interconnection

Jong-Woong Kim, Ja-Myeong Koo, Jeong-Won Yoon, Sunglak Choi, Kyung-Sik Kim, Jae-Do Nam and Seung-Boo Jung.
Materials Transactions, 48, 1070 (IF: 0.689)

Effect of bonding force on the reliability of the flip chip packages employing anisotropic conductive film with reflow process

Jong-Woong Kim and Seung-Boo Jung.
Materials Science & Engineering A, 452-453, 267 (IF: 2.647)