Effect of Reflow Process on Solder Joing Reliability under Free-Form Surface Conditions > Journal | 성균관대 김종웅 교수님 SDPL 연구실

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Soft Devices & Packaging Laboratory

Journal

Under Review Effect of Reflow Process on Solder Joing Reliability under Free-Form Surface Conditions

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작성자 최고관리자 작성일 25-10-10 14:54

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Author: Taeyoon Im et al

Journal: Journal of Materials Engineering and Performance

Vol: (Under review)

Year: Under Review

IF: 2.6

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