Publication

Soft Devices & Packaging Laboratory

Journal

Under Review Precursor-Assisted Engineering of Accessible Pore Topology in Spherical h-BN for Thermally Conductive and Dielectrically Benign Underfill Composites

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작성자 최고관리자 작성일 26-03-30 13:25

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Author
Jung Bin Shin et al
Journal
Advanced Composites and Hybrid Materials
Vol
(Under review)
Year
Under Review
IF
15.5